半导体行业英文资讯

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. The post AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026 appeared first on Semiconductor Digest .

The Rigaku Group will exhibit at “SEMICON Taiwan 2026,” taking place September 2 to 4, 2026, at TaiNEX 1 and 2 in Taipei. The post Rigaku to Showcase Advanced X-ray Metrology and Inspection Solutions at SEMICON Taiwan 2026 appeared first on Semiconductor Digest .

Supporting the transition to ‘shrink–and–stack' as part of Qnity's end-to-end advanced packaging portfolio. The post Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging appeared first on Semiconductor Digest .

As transistor dimensions continue to shrink, though, structural disorder in metals and at metal-semiconductor interfaces increasingly impedes carrier injection and transport. Metals therefore need a level of structural order comparable to that of single-crystal semiconductors in order to push device performance toward its physical limits. The post Researchers Develop Stepwise Evaporation Method to Reduce Contact Resistance in Transistors appeared first on Semiconductor Digest .

By harnessing the properties of gallium nitride, EPFL engineers have built a tiny transistor that can handle very high voltage with minimal energy loss, a key requirement for AI data centers, electric vehicles, and solar power systems. The post New Transistor Brings High Voltage to Microchip Scale appeared first on Semiconductor Digest .

Diodes Incorporated today announced the successful completion of its acquisition of ElevATE Semiconductor, Inc., a provider of high-performance integrated circuits for the Automated Test Equipment (ATE) market, in an all-cash transaction for $250 million. The post Diodes Completes Acquisition of ElevATE Semiconductor appeared first on Semiconductor Digest .

First graduating class and fifth signing cohort highlight momentum behind Micron's workforce development partnerships in Virginia. The post Micron Celebrates First Manassas Apprenticeship Graduates appeared first on Semiconductor Digest .

BTU International, a supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, announced the availability of an advanced Formic Acid Reflow capability across multiple reflow oven platforms. The post BTU Formic Acid Reflow Technology Advances Fluxless Soldering for Next-Generation Semiconductor Packaging appeared first on Semiconductor Digest .

Silicon Forest facility to support collaborative innovation with chip makers; first milestone in more than $3B planned expansion of global lab network. The post Lam Research Breaks Ground on New Oregon Lab appeared first on Semiconductor Digest .

Inside every electronic device, the flow of electricity is controlled by a switch called a transistor. For decades, these switches were made from silicon. More recently, engineers have turned to a material called gallium nitride (GaN), which enables small, efficient devices like smartphone chargers.

Gold has been the safe choice for perovskite solar cells. We found a way to stop needing it.

Northrop Grumman is pioneering a new wave of microelectronics with a $7 million contract to create diamond-cooled chips that deliver higher power, faster speeds and dramatically enhanced performance for military radar and communications. The post Northrop Grumman Advances Microchip Tech with Diamond Cooling Innovation appeared first on Semiconductor Digest .

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced the official opening of its Physical AI & Robotics Lab in Beijing, China. The post Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation appeared first on Semiconductor Digest .

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced keynotes and program highlights for this year’s SEMICON West . The post SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Technologies Powering the Industry’s Next Era appeared first on Semiconductor Digest .

Thermo Fisher Scientific Inc. today introduced the Thermo Scientific EMPAD G2 detector, a new detector designed to help researchers see and understand materials in unprecedented detail. The post Thermo Fisher Scientific Introduces the Thermo Scientific EMPAD G2 Electron Detector to Advance Materials Research appeared first on Semiconductor Digest .

Continued investments through 2032 will further strengthen the companies' long-standing joint venture and drive meaningful, multi-year flash memory-supply. The post Kioxia and Sandisk to Invest Over $31 Billion in Japan appeared first on Semiconductor Digest .

Investing over $4 billion in Indiana fab and first 'Made in USA' next-generation HBM mass production in U.S. to begin in H2 2029. The post SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana appeared first on Semiconductor Digest .

Metals, semiconductors and insulators are fundamental components of modern electronics. However, efforts to improve device performance have largely focused on semiconductor quality, while metal crystallinity has received far less attention.

Researchers based in Japan, USA and China propose an improved process for thin p-type gallium nitride (GaN) ohmic contacts by ultrathin magnesium (Mg) deposition and brief thermal annealing...

A new set of modular components allows users to create reconfigurable smart devices with electrical connections that keep working no matter what shape the structure forms.

LG Chem will participate in SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, to showcase advanced packaging and power semiconductor material solutions for AI semiconductors and expand collaboration with semiconductor customers. The post LG Chem to Showcase Advanced Packaging Material Solutions for AI Semiconductors at SEMICON Taiwan 2026 appeared first on Semiconductor Digest .

Keysight Technologies, Inc. today announced that AttoTude Inc. has expanded its use of Keysight EDA software to manage its full IC design workflow. The post Keysight Accelerates AttoTude IC Design Cycles by More Than 50% appeared first on Semiconductor Digest .

Former Check Point Software president, Oracle and Cerebras CMO, and 23-year Intel veteran joins NextSilicon to scale global sales, marketing, partnerships and customer adoption. The post NextSilicon Appoints Rupal Hollenbeck President and Chief Business Officer appeared first on Semiconductor Digest .

Platform from Mark Ren, who pioneered AI for chip design at NVIDIA, enables engineering teams to build and own a self-improving agentic workforce for chip design. The post Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers appeared first on Semiconductor Digest .

A research team has developed a flexible near-infrared (NIR) photodetector that delivers photoresponsivity more than five times higher while maintaining its performance under repeated bending. The technology is expected to serve as a core platform for next-generation flexible optoelectronic devices, including wearable health care devices, medical diagnostic sensors and optical communication receivers.

Fuel cells, devices that generate electricity by converting the chemical energy of hydrogen or other fuels via electrochemical reactions, are promising solutions for powering large electric vehicles, industrial sites and remote facilities. To drive the necessary reactions, solid oxide fuel cells rely on ceramic, heat-resistant electrolytes, solid materials that transport ions between two electrodes.

Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to Gartner, Inc., a business and technology insights company. The post Gartner Forecasts Worldwide Semiconductor Revenue to Reach $1.6 Trillion in 2026 appeared first on Semiconductor Digest .

Integrated portfolio spans metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D and panel-level architectures. The post Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions appeared first on Semiconductor Digest .

Funds will accelerate AI design automation platform and customer projects. The post Celera Semiconductor Announces the Closing of a $30M Series B Financing Round appeared first on Semiconductor Digest .

Researchers at Princeton Engineering have created a semiconductor with unique properties: It is just a few molecules thick and can repeatedly change its properties in response to light. This is a step toward building more energy-efficient sensors, optoelectronic devices and computing technologies.

AMD will offer the first Versal adaptive SoCs supporting Universal Chiplet Interconnect Express connectivity, enabling direct communication with co-packaged chiplets built for specialized workloads. The post AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs appeared first on Semiconductor Digest .

Primemas Inc. showcased its latest CXL memory innovations at the Future of Memory and Storage (FMS) 2026. The post Primemas at FMS 2026: CXL Full-Stack Products and Micron Collaboration on the Abaco Project appeared first on Semiconductor Digest .

The agreement gives Scientech Corporation the right to distribute all of Trymax’s NEO ashing, etching products and their latest UV curing and charge erase products. The post Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan appeared first on Semiconductor Digest .