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Semiconductor / Electronic Components / Supply Chain

Semiconductor Industry News

Verified English headlines for semiconductors, electronic components, AI chips, supply chain, manufacturing, and power electronics.

Last updated: Sep 01, 05:34 PM
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SemiconductorsSemiconductor Digest
Wafer-Scale P-Type 2D Semiconductor Clears a Key Hurdle for Next-Generation Chips

A wafer-scale 2D semiconductor combines high hole mobility, strong stability and transistor performance, advancing next-generation CMOS electronics. The post Wafer-Scale P-Type 2D Semiconductor Clears a Key Hurdle for Next-Generation Chips appeared first on Semiconductor Digest .

Aug 31, 08:36 PM
SemiconductorsSemiconductor Digest
PolyU Develops Quantum-Tunnelling Field-Effect Transistor

The next generation of microelectronics relies on radical improvements in transistor switching performance to advance computing power. The post PolyU Develops Quantum-Tunnelling Field-Effect Transistor appeared first on Semiconductor Digest .

Aug 31, 08:33 PM
AI ChipsSemiconductor Digest/21 hours ago
AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. The post AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026 appeared first on Semiconductor Digest .

AI ChipsSupply ChainSemiconductorsAug 31, 08:19 PM
Supply ChainSemiconductor Digest/21 hours ago
Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

Supporting the transition to ‘shrink–and–stack' as part of Qnity's end-to-end advanced packaging portfolio. The post Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging appeared first on Semiconductor Digest .

Supply ChainSemiconductorsAug 31, 08:09 PM
Power ElectronicsSemiconductor Digest/4 days ago
Researchers Develop Stepwise Evaporation Method to Reduce Contact Resistance in Transistors

As transistor dimensions continue to shrink, though, structural disorder in metals and at metal-semiconductor interfaces increasingly impedes carrier injection and transport. Metals therefore need a level of structural order comparable to that of single-crystal semiconductors in order to push device performance toward its physical limits. The post Researchers Develop Stepwise Evaporation Method to Reduce Contact Resistance in Transistors appeared first on Semiconductor Digest .

Power ElectronicsSemiconductorsAug 28, 05:32 PM
AI ChipsSemiconductor Digest/4 days ago
New Transistor Brings High Voltage to Microchip Scale

By harnessing the properties of gallium nitride, EPFL engineers have built a tiny transistor that can handle very high voltage with minimal energy loss, a key requirement for AI data centers, electric vehicles, and solar power systems. The post New Transistor Brings High Voltage to Microchip Scale appeared first on Semiconductor Digest .

AI ChipsAutomotiveSemiconductorsAug 28, 05:29 PM
SemiconductorsSemiconductor Digest/4 days ago
Diodes Completes Acquisition of ElevATE Semiconductor

Diodes Incorporated today announced the successful completion of its acquisition of ElevATE Semiconductor, Inc., a provider of high-performance integrated circuits for the Automated Test Equipment (ATE) market, in an all-cash transaction for $250 million. The post Diodes Completes Acquisition of ElevATE Semiconductor appeared first on Semiconductor Digest .

SemiconductorsAug 28, 05:26 PM
SemiconductorsSemiconductor Digest/4 days ago
Micron Celebrates First Manassas Apprenticeship Graduates

First graduating class and fifth signing cohort highlight momentum behind Micron's workforce development partnerships in Virginia. The post Micron Celebrates First Manassas Apprenticeship Graduates appeared first on Semiconductor Digest .

SemiconductorsAug 28, 05:21 PM
Supply ChainSemiconductor Digest/4 days ago
BTU Formic Acid Reflow Technology Advances Fluxless Soldering for Next-Generation Semiconductor Packaging

BTU International, a supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, announced the availability of an advanced Formic Acid Reflow capability across multiple reflow oven platforms. The post BTU Formic Acid Reflow Technology Advances Fluxless Soldering for Next-Generation Semiconductor Packaging appeared first on Semiconductor Digest .

Supply ChainManufacturingSemiconductorsAug 28, 05:15 PM
Supply ChainSemiconductor Digest/4 days ago
Lam Research Breaks Ground on New Oregon Lab

Silicon Forest facility to support collaborative innovation with chip makers; first milestone in more than $3B planned expansion of global lab network. The post Lam Research Breaks Ground on New Oregon Lab appeared first on Semiconductor Digest .

Supply ChainManufacturingSemiconductorsAug 28, 05:10 PM
Power ElectronicsTechXplore/4 days ago
New transistor brings high voltage to microchip scale

Inside every electronic device, the flow of electricity is controlled by a switch called a transistor. For decades, these switches were made from silicon. More recently, engineers have turned to a material called gallium nitride (GaN), which enables small, efficient devices like smartphone chargers.

Power ElectronicsSemiconductorsAug 28, 02:40 PM
SemiconductorsSemiconductor Digest/5 days ago
Northrop Grumman Advances Microchip Tech with Diamond Cooling Innovation

Northrop Grumman is pioneering a new wave of microelectronics with a $7 million contract to create diamond-cooled chips that deliver higher power, faster speeds and dramatically enhanced performance for military radar and communications. The post Northrop Grumman Advances Microchip Tech with Diamond Cooling Innovation appeared first on Semiconductor Digest .

SemiconductorsAug 27, 07:12 PM
AI ChipsSemiconductor Digest/5 days ago
Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced the official opening of its Physical AI & Robotics Lab in Beijing, China. The post Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation appeared first on Semiconductor Digest .

AI ChipsPower ElectronicsSemiconductorsAug 27, 07:09 PM
Supply ChainSemiconductor Digest/5 days ago
SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Technologies Powering the Industry’s Next Era

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced keynotes and program highlights for this year’s SEMICON West . The post SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Technologies Powering the Industry’s Next Era appeared first on Semiconductor Digest .

Supply ChainManufacturingSemiconductorsAug 27, 07:07 PM
SemiconductorsSemiconductor Digest/5 days ago
Thermo Fisher Scientific Introduces the Thermo Scientific EMPAD G2 Electron Detector to Advance Materials Research

Thermo Fisher Scientific Inc. today introduced the Thermo Scientific EMPAD G2 detector, a new detector designed to help researchers see and understand materials in unprecedented detail. The post Thermo Fisher Scientific Introduces the Thermo Scientific EMPAD G2 Electron Detector to Advance Materials Research appeared first on Semiconductor Digest .

SemiconductorsAug 27, 07:02 PM
SemiconductorsSemiconductor Digest/5 days ago
Kioxia and Sandisk to Invest Over $31 Billion in Japan

Continued investments through 2032 will further strengthen the companies' long-standing joint venture and drive meaningful, multi-year flash memory-supply. The post Kioxia and Sandisk to Invest Over $31 Billion in Japan appeared first on Semiconductor Digest .

SemiconductorsAug 27, 06:57 PM
AI ChipsSemiconductor Digest/5 days ago
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana

Investing over $4 billion in Indiana fab and first 'Made in USA' next-generation HBM mass production in U.S. to begin in H2 2029. The post SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana appeared first on Semiconductor Digest .

AI ChipsSupply ChainManufacturingSemiconductorsAug 27, 06:55 PM
AI ChipsSemiconductor Digest/6 days ago
LG Chem to Showcase Advanced Packaging Material Solutions for AI Semiconductors at SEMICON Taiwan 2026

LG Chem will participate in SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, to showcase advanced packaging and power semiconductor material solutions for AI semiconductors and expand collaboration with semiconductor customers. The post LG Chem to Showcase Advanced Packaging Material Solutions for AI Semiconductors at SEMICON Taiwan 2026 appeared first on Semiconductor Digest .

AI ChipsPower ElectronicsSupply ChainSemiconductorsAug 26, 06:46 PM
SemiconductorsSemiconductor Digest/6 days ago
Keysight Accelerates AttoTude IC Design Cycles by More Than 50%

Keysight Technologies, Inc. today announced that AttoTude Inc. has expanded its use of Keysight EDA software to manage its full IC design workflow. The post Keysight Accelerates AttoTude IC Design Cycles by More Than 50% appeared first on Semiconductor Digest .

SemiconductorsAug 26, 06:40 PM
SemiconductorsSemiconductor Digest/6 days ago
NextSilicon Appoints Rupal Hollenbeck President and Chief Business Officer

Former Check Point Software president, Oracle and Cerebras CMO, and 23-year Intel veteran joins NextSilicon to scale global sales, marketing, partnerships and customer adoption. The post NextSilicon Appoints Rupal Hollenbeck President and Chief Business Officer appeared first on Semiconductor Digest .

SemiconductorsAug 26, 06:36 PM
AI ChipsSemiconductor Digest/6 days ago
Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers

Platform from Mark Ren, who pioneered AI for chip design at NVIDIA, enables engineering teams to build and own a self-improving agentic workforce for chip design. The post Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers appeared first on Semiconductor Digest .

AI ChipsSemiconductorsAug 26, 06:33 PM
ComponentsTechXplore/6 days ago
Flexible sensor detects near-infrared light with higher response after repeated bending

A research team has developed a flexible near-infrared (NIR) photodetector that delivers photoresponsivity more than five times higher while maintaining its performance under repeated bending. The technology is expected to serve as a core platform for next-generation flexible optoelectronic devices, including wearable health care devices, medical diagnostic sensors and optical communication receivers.

ComponentsSemiconductorsAug 26, 04:00 PM
AutomotiveTechXplore/6 days ago
Aurivillius-type materials could lower the operating temperature of fuel cells

Fuel cells, devices that generate electricity by converting the chemical energy of hydrogen or other fuels via electrochemical reactions, are promising solutions for powering large electric vehicles, industrial sites and remote facilities. To drive the necessary reactions, solid oxide fuel cells rely on ceramic, heat-resistant electrolytes, solid materials that transport ions between two electrodes.

AutomotiveSemiconductorsAug 26, 12:00 PM
SemiconductorsSemiconductor Digest/7 days ago
Gartner Forecasts Worldwide Semiconductor Revenue to Reach $1.6 Trillion in 2026

Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to Gartner, Inc., a business and technology insights company. The post Gartner Forecasts Worldwide Semiconductor Revenue to Reach $1.6 Trillion in 2026 appeared first on Semiconductor Digest .

SemiconductorsAug 25, 08:24 PM
ComponentsTechXplore/7 days ago
Erasable semiconductor is programmed with light

Researchers at Princeton Engineering have created a semiconductor with unique properties: It is just a few molecules thick and can repeatedly change its properties in response to light. This is a step toward building more energy-efficient sensors, optoelectronic devices and computing technologies.

ComponentsSemiconductorsAug 25, 08:20 PM
SemiconductorsSemiconductor Digest/7 days ago
AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs

AMD will offer the first Versal adaptive SoCs supporting Universal Chiplet Interconnect Express connectivity, enabling direct communication with co-packaged chiplets built for specialized workloads. The post AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs appeared first on Semiconductor Digest .

SemiconductorsAug 25, 08:20 PM
Supply ChainSemiconductor Digest/8 days ago
Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan

The agreement gives Scientech Corporation the right to distribute all of Trymax’s NEO ashing, etching products and their latest UV curing and charge erase products. The post Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan appeared first on Semiconductor Digest .

Supply ChainSemiconductorsAug 24, 09:09 PM

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